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  1. 1. Test Sockets and Burn-in Cycling Sockets
    - For package testing of semiconductor devices: Memory, Logic, RF, Sensor, Burn-in, etc.
    - Various package types: BGA, LGA, MLF, QFN, WLCSP (Wafer Level Chip-Scale Package) and others
  2. 2. Interposers (Silicone Rubber)
    - For probe cards and pad-to-pad interconnections to provide physical and electrical interface between tester and DUT
  3. 3. Manual Test Solutions
    - For low-volume and product development applications
    - Manual Test Housing, Test JIG
  4. 4. Leadframe (Finger) Test Solutions
    - Finger Test Sockets
 
- Various semiconductor device types: Memory, Logic, RF, Sensor, Burn-in, and others
- Various package types: BGA, LGA, MLF, QFN, WLCSP(Wafer Level Chip-Scale Package) and others
- For probe cards and pad-to-pad interconnections to provide physical and electrical interface between tester and DU
- For low-volume and product development applications
- Manual Test Housing, Test JIG, and other
- Finger test sockets
- Specially-treated tips (e.g.,tungsten) for customer needs and durability